Install before the reflow process. It can be installed on the top of the upper sound hole microphone or the circuit board of bottom back of the lower sound hole microphone.

MicroVent MV-S100 Install before the reflow process. It can be installed on the top of the upper sound hole microphone or the circuit board of bottom back of the lower sound hole microphone.

S200 for MEMS Mic. It is installed inside the MEMS microphone during the packaging process to achieve particle protection. At the same time, no special treatment is required during the circuit board assembly process