MicroVent MV-S100 Install before the reflow process. It can be installed on the top of the upper sound hole microphone or the circuit board of bottom back of the lower sound hole microphone.
Order email
han.zhang09@china-venting.comS100 for FPC assembly
Install before the reflow process. It can be installed on the top of the upper sound hole microphone or the circuit board of bottom back of the lower sound hole microphone.
| Factory | MicroVent |
| Model | MV-S100 |
| Characteristic | Acoustic breathable Hydrophobic |
| Air Permeability @ 70mbar（1.5 hole） | >9500 ml/min/cm2 |
| Inlet Pressure | @ 70mbar |
| Adhesive Type | Silicone based |
| Thickness | 0.15 mm |
| Application Temperature | Max.260℃ for 3 mins |
